云南快乐十分走势图

电子产品开发线路板散热设计基材选择方法

RIQI:2018-05-26 / RENQI: / LAIYUAN:aolongjixie.com

1.选材

云南快乐十分走势图 PCBJICAIYINGGENJUHANJIEYAOQIUHEYINZHIBANJICAIDENAIREXING,XUANZENAIREXINGHAO、CTE(Coefficients of Thermal Expansion,REPENGZHANGXISHU)JIAOXIAOHUOYUYUANQIJIAN CTE XIANGSHIYINGDEYINZHIBANJICAI,JINLIANGJIANXIAOYUANQIJIANYUYINZHIBANJICAIZHIJIANDECTEXIANGDUICHA。

基材的玻璃化转变温度(Tg)是衡量基材耐热性的重要参数之一,一般基材的 Tg 低,热膨胀系数就大,特别是在 Z 方向(板的厚度方向)的膨胀更为明显,容易使镀覆孔损坏;基材的 Tg高,一般膨胀系数小,耐热性相对较好,但是 Tg过高基材会变脆,机械加工性下降。故选材时要兼顾基材的综合性能。

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热膨胀对PCB的影响

2.CTE(热膨胀系数)的匹配

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采用陶瓷基板封装的元器件的 CTE 典型值为 5~7×10−6/℃,无引线陶瓷芯片载体LCCC 的 CTE 范围是 3.5~7.8×10−6云南快乐十分走势图/℃,有的器件基板材料采用与某些印制板基材相同的材料,如 PI、BT 和耐热环氧树脂等。不同材料的 CTE 值如下表。在选择印制板的基材时应尽量考虑使基材的热膨胀系数接近于器件基板材料的热膨胀系数。

不同PCB线路板基材的CTE(热膨胀系数)值
材料 CTE范围(×10−6/℃)
散热片用铝板 20~24
17~18.3
环氧E玻璃布 13~15
BT树脂—E玻璃布 12~14
聚酰亚胺—E玻璃布 12~14
氰酸酯—E玻璃布 11~13
氰酸酯—S玻璃布 8~10
聚酰亚胺E玻璃布及铜—因瓦—铜 7~11
非纺织芳酰胺/聚酰亚胺 7~8
非纺织芳酰胺/环氧 7~8
聚酰亚胺石英 6~10
氰酸酯石英 6~9
环氧芳酰胺布 5.7~6.3
BT—芳酰胺布 5.0~6.0
聚酰亚胺芳酰胺布 5.0~6.0
铜—因瓦—铜12.5/75/12.5 3.8~5.5

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作者:电子产品设计


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